70mm x 70 mm QSeven™ (2.0) 板型
搭載高性能NXP 1.0GHz i.MX 6QuadPlus/i.MX 6DualLite ARM Cortex-A9芯片
支持-20°C ~ 70°C寬溫工作范圍
支持雙通道18/24-bit LVDS
提供評測底板
威盛QSM-8Q60是一款ARM架構Qseven?板型模塊，可選搭載圖像內存性能升級的1.0GHz NXP i.MX 6QuadPlus Cortex-A9 ARM系統芯片，或1.0GHz NXP i.MX 6DualLite Cortex-A9 dual core系統芯片，完美保障了高性能和豐富多媒體功能之間的平衡。其超緊湊設計適用于各種嵌入式系統應用，如工業自動化、交通、醫療及娛樂等。
硬 件威盛QSM-8Q60尺寸為70 mm x 70 mm，完全符合Standardization Group for Embedded Technologies e.V. (SGeT)采用的Qseven? Rev. 2.0嵌入式板型標準。支持-20°C ~ 70°C寬溫工作范圍，專為惡劣環境設計，提供更好的靈活性。
威盛QSM-8Q60板載 Micro SD卡槽，4GB eMMC閃存及 2GB DDR3-10666 SDRAM。同時，該模塊也提供豐富的I/O接口和顯示擴展選擇，包括四個USB 2.0接口、一個HDMI接口、一個雙通道18/24-bit LVDS面板、兩個3 COM (TX/RX) 口、千兆以太網、2 CAN bus 及一個PCIe接口。
軟 件威盛QSM-8Q60提供了搭載kernel (4.1.15) 及引導程序原始碼的Linux BSP軟件工具包，可支持基于NXP i.MX 6DualLite和 NXP i.MX 6QuadPlus系統芯片平臺。其它功能包括一個幫助調整kernel及支持威盛QSMBD2開發基板界面的Tool Chain和其他硬件功能。
同時，威盛還提供整套軟件客制化服務，幫助客戶加快上市時間，降低開發成本。
擴展性客戶可以利用天际彩票接口豐富的評測底板和業內一流的技術支持能力開發客制化架構主板。
點擊此處下載QSM-8Q60數據資料PDF版，或瀏覽以下信息：
| 型號 | QSM-8Q60-QP | QSM-8Q60 |
|---|---|---|
| 處理器 | 1.0GHz NXP i.MX 6QuadPlus Cortex-A9 quad-core SoC | 1.0GHz NXP i.MX 6DualLite Cortex-A9 dual-core SoC |
| 系統內存 | 2GB DDR3-1066 SDRAM | |
| 板載存儲 | 4GB eMMC Flash memory | |
| Boot Loader | 4MB SPI Flash ROM | |
| 顯卡 | Vivante GC2000+ GPU | Vivante GC880 |
| 3 integrated, independent 3D/2D and video graphics processing units Supports OpenGL? ES 2.0, OpenCL and OpenVG? 1.1 hardware accleration Supports MPEG-2, VC-1and H.264 video decoding up to 1080p Supports SD encoding | 2 Independent, integrated 3D/2D graphics processing units Graphics engines support OpenGL? ES 2.0, OpenVG 1.1 hardware acceleration Supports MPEG-2, VC-1 video decoding up to 1080p | |
| LAN | Micrel KSZ9031RNX Gigabit Ethernet Transceiver with RGMII support | |
| 音頻 | I2S Audio Interface | |
| HDMI | Integrated HDMI 1.4 Transmitter | |
| USB | SMSC USB2514 USB 2.0 High Speed 4-port hub controller | |
| 支持擴展 I/O | 1 PCIe x1 | |
| 擴展 I/O | 4 USB 2.0 ports 1 USB OTG client 1 HDMI port 1 Dual-channel 18/24-bit LVDS panel 1 PWM 3 COM (TX/RX) ports 1 Gigabit Ethernet 2 CAN bus 1 I2S 1 SPI 1 SDIO/GPIO 1 I2C | |
| 板載 I/O | 1 Micro SD card slot | |
| 操作系統 | Linux kernel 4.1.15 | Linux kernel 3.14.28 |
| 工作溫度 | -20°C ~ 70°C | |
| 存儲溫度 | -20°C ~ 70°C | |
| 工作濕度 | 0% ~ 95% (non-condensing) | |
| 產品尺寸 | 7.0cm x 7.0cm (2.76" x 2.76") | |
| 認證 | Qseven? Rev. 2.0 module | |
1 Dual-channel 18/24-bit LVDS panel
1 PWM
3 COM (TX/RX) ports
1 Gigabit Ethernet
2 CAN bus
1 I2S
1 SPI
1 SDIO/GPIO
1 I2C
板載 I/O1 Micro SD card slot
操作系統Linux kernel 4.1.15Linux kernel 3.14.28
工作溫度-20°C ~ 70°C
存儲溫度-20°C ~ 70°C
工作濕度0% ~ 95% (non-condensing)
產品尺寸7.0cm x 7.0cm (2.76" x 2.76")
認證Qseven? Rev. 2.0 module
| 文件 | 版本 | 日期 |
|---|---|---|
| 設計指南 | v1.00 | 2020-09-02 |
| 用戶手冊 | v1.04 | 2020-09-02 |
| Linux | ||
| Linux 開發指南 for BSP v3.0.2 | v1.00 | 2018-03-09 |
| Linux 快速入門指南 for EVK v3.0.2 | v1.00 | 2018-03-09 |
| 軟件 | 版本 | 日期 |
|---|---|---|
| Linux Board Support Package (BSP) 5.8GB | v3.0.2 | 2018-03-09 |
| Linux Evaluaiton Kit (EVK) 380.3MB | v3.0.2 | 2018-03-09 |
重要: 一旦下載該系列軟件包，表明您已同意軟件許可協議。如您不同意軟件協議的任何條款和條件，請不要繼續下載該軟件。
U-Boot version: 2015.04
Kernel version: 4.1.15
Evaluation image: OpenEmbedded-core built with Yocto 2.0 Jethro
Development based on NXP fsl-yocto-L4.1.15_1.1.0-ga (Yocto 2.0 Jethro)
Support SPI with eMMC or Micro SD boot (default)
Support HDMI or LVDS single display (default HDMI output)
Support HDMI audio output
Support AUO LVDS resistive touch panels (through USB interface)
AUO 10.4″ G104XVN01.0 (1024×768)
AUO 7″ G070VW01 (800×480)
Supports COM1 and COM3 (TX/RX), COM2 as debug port
Supports COM4, COM5, COM6 and COM7 (RS-232 / RS-422 / RS-485)
Supports 2 CAN bus (TX/RX)
Supports Gigabit Ethernet (LAN1)
Supports 10/100Mbps Ethernet (LAN2)
Supports Line-in, Line-out, Mic-in
Supports VNT9271 USB Wi-Fi dongle
Supports EMIO-2531 miniPCIe Wi-Fi & BT module
Supports Bluetooth A2DP and SPP profile
Supports EMIO-1541 miniPCIe Wi-Fi module
Supports GPIO, RTC and Watchdog Timer
BSP v3.0.2 Bug Fixes and Modifications
Changed CPU settings back to NXP default.
Fixed a u-boot bug that was showing incorrect low temperature.
Fixed a kernel bug that caused system boot hangs on HDMI at high temperature.
| 型號 | SoC | 描述 |
|---|---|---|
| 10GEC10H40020 | NXP i.MX 6QuadPlus Cortex-A9 @ 1.0GHz | Qseven? module with 1.0GHz NXP i.MX 6QuadPlus Cortex-A9, 4GB eMMC, 4MB SPI ROM,2GB DDR3 SDRAM, HDMI, 4 USB 2.0, 1 USB OTG client, LVDS, 3 COM (TX/RX), 2 CAN bus,Gigabit Ethernet, 10/100Mbps Ethernet, PCIe x1, Micro SD card slo |
| 10GEC10700020 | NXP i.MX 6DualLite Cortex-A9 @ 1.0GHz | QsevenTM module with 1.0GHz NXP i.MX 6DualLite Cortex-A9, 4GB eMMC, 4MB SPI ROM,2GB DDR3 SDRAM, HDMI, 4 USB 2.0, 1 USB OTG client, LVDS, 3 COM (TX/RX), 2 CAN bus,Gigabit Ethernet, 10/100Mbps Ethernet, PCIe x1, Micro SD card slo |
| 10GFL00000020 | N/A | QSM-8Q60 evaluation carrier board (QSMDB2) with CAN bus cable and DC power cable |
| 型號 | 描述 |
|---|---|
| 00GO27100BU2B0D0 | VNT9271 IEEE 802.11b/g/n USB Wi-Fi dongle |
| EMIO-2531-00A1 | VAB-820-W-M IEEE 802.11b/g/n miniPCIe Wi-Fi & Bluetooth module with assembly kit and antenna |
